Flexible PCB Assembly
Mondo is the perfect choice for your Flexible PCB SMT Assembly needs. Contact us and let us help skyrocket your business.
Flexible PCB Assembly Service
How can we help customers with their Flexible PCB Assembly? Mondo Technology is an expert in flexible PCB manufacturing and assembly. Our specialization in this field has made us one of the top three flex PCB assembly factories in China.
When it comes to Flexible PCB Assembly, we offer a range of comprehensive services to meet our customers’ needs. Our skilled team, equipped with state-of-the-art technology, ensures precise and efficient assembly processes. Whether you require small-scale or large-scale assembly, we have the capacity and capability to deliver high-quality results.
What Is Flex PCB Assembly SMT Process
SMT (Surface Mount Technology), is the most popular technology and process in the electronic assembly industry. SMT assembly is a more efficient process in which components are welded directly to the plate. By eliminating the need to run leads through the PCB, the process becomes faster, more efficient, and more cost-effective. SMT assembly also saves space, allowing more components to fit on smaller boards. Mondo Technology provides flexible PCB SMT assembly service, which involves 7 main process flows.
Incoming material inspection
Inspect whether components and bonding pads are oxidized, whether solder paste components are matched, and the coplanarity of integrated circuit pins.
Advantages of SMT Assembly
SMT is a new generation Flex PCB Manufacturing Process of electronic assembly technology, which integrates traditional electronic components into compact devices with significantly reduced volume. This enables high density, high reliability, miniaturization, cost-effectiveness, and automation in the assembly of electronic products.
These miniaturized components are known as SMD devices (or SMC, chip devices). The process of assembling these components onto a flexible printed board (PCB) is referred to as the SMT process.
SMT is a complex process where each component is strategically positioned and installed on the board to optimize functionality. This is one of the reasons why SMT and SMD are often used interchangeably.
Depending on the product’s specific properties, component count, and placement speed, it is suitable to use medium to high-speed placement machines for component installation. Since each piece of FPC has optical marks for positioning, there are significant differences between upward SMD placement on FPC and upward placement on a rigid PCB.
It is important to note that while the FPC is fixed on the carrier board, its surface may not be as flat as a rigid PCB. There may be some gaps between the FPC and the carrier board. Therefore, precise settings are required for the suction nozzle position, atmospheric pressure, and nozzle speed reduction.
Additionally, since a significant portion of FPCs are connected to the board, the yield of FPCs is relatively lower. It is normal for the whole panel (PNL) to contain some defective PCS. Therefore, placement machines must have the capability to identify and mark defective components. Otherwise, in production scenarios where non-integrated PNLs contain good boards, the production rate will be greatly reduced.
Solder paste printing
Print solder paste on the bonding pad of the Flex PCB using a printer, special printing scraper, and SMT steel mesh.
Printing Inspection
Check for missed printing and excess solder paste on the printed circuit board, and ensure the appropriate amount of solder paste.
Chip Mounting
Mount components using high-speed machines and multi-function machines.
Pre-furnace Inspection
Check for incorrectly placed or missing components and perform necessary repairs.
Reflow Soldering
Ensure the proper working conditions of reflow soldering, including temperature curve settings, using SMT reflow soldering equipment.
Post-furnace Inspection
Check for welding defects such as false welding, continuous welding, offset, and side standing. This can be done using an AOI optical detector or through manual and visual inspection.
SMT process capability and advantages
Mondo Technology’s factory is equipped with advanced devices from renowned Japanese brands, such as Juki SMT devices. These machines ensure high precision in placing components and applying solder paste, resulting in reliable and secure connections. The use of high-precision paste components further enhances the accuracy of the assembly process, minimizing the risk of components falling off or becoming dislodged.
| Solder paste printing | Automatic loading and unloading machine, laser stencil thickness 0.08-0.15mm, Chip components 0201-1206, all kinds of LED lamp beads/Q/D/IC/BGA/CON and other components. |
| Online SPI | Online detection of solder paste printing quality, when there are undesirable phenomena such as offset/tin connection/less tin, it can immediately alarm to determine that it is defective, and the engineering technician will process and adjust it to avoid flowing into the next process. |
| Mounting | Mounting component specifications 0201-74mm, circuit board size 600-370mm, accuracy ± 35um (CPK≧1), with precision camera. |
| Reflow soldering | JT double track 8 temperature zone &10 temperature zone hot air reflow soldering. |
| Online AOI | Can detect 2 different models of products at the same time, independently store data, convenient for access and tracking. |
| Placement machine model | Japan JUKI3010/RS-1/RS-1R series; |
| Automatic printing machine | Desen DS-1008, Zhengshi ZS-A5 series; |
| Double-track reflow soldering | Jintuo; |
| Dual-track online AOI | Hurley; |
| SPI | Steike; |
Why Choose Mondo for Your Assembly Needs
There are two key advantages to consider when choosing Mondo to provide assembly services: reflow soldering of Flexible Printed Circuit (FPC) and comprehensive inspection, testing, and sub-board capabilities.
Reflow Soldering of FPC
We utilize advanced forced hot air convection infrared reflow ovens for soldering Flexible Printed Circuits (FPCs). This ensures a more uniform temperature distribution across the FPC, reducing the occurrence of soldering defects. Compared to using single-sided tape for fixation, our reflow soldering process minimizes the risk of FPC deformation, thereby mitigating issues such as poor soldering, voids, and solder bridges. Through precise temperature curve testing and setting, we optimize soldering quality and enhance overall production efficiency.
Inspection, Testing, and Sub-board of FPC
We conduct thorough inspection, testing, and sub-board processes for FPCs. Following reflow soldering, we employ cooling fans at the furnace outlet to expedite the temperature reduction of FPCs and carrier boards. Our operators wear heat-insulating gloves to handle the high-temperature carrier boards, ensuring safety. With utmost care, we remove soldered FPCs from the carrier boards and visually inspect them under magnification. Our focus lies on identifying issues such as residual adhesive, discoloration, tin dip on gold fingers, solder beads, empty solder joints, and solder bridges.
In addition to visual inspections, we utilize specialized test fixtures to perform In-Circuit Testing (ICT) and Functional Circuit Testing (FCT) for FPCs. This comprehensive approach ensures the quality and functionality of the FPCs.
Mondo possesses extensive expertise and experience in reflow soldering of FPCs as well as comprehensive inspection, testing, and sub-board processes. We are the ideal partner for your assembly needs.
FAQ
We specialize in the assembly of Single-Sided Flexible PCBs, Double-Sided Flexible PCBs, and Multi-Layered Flexible PCBs. If you require specific examples of our past projects, please reach out to our sales consultant, and they will be happy to provide you with the requested information.