Flexible PCB Process Capability
Mondo focus on the fabrication and assembly of flexible printed circuits, and the following two tables will show our company’s process capabilities.
Production Process Capability
The table below presents the key aspects of Mondo Flexible PCB Process Capability, including flexible materials, minimum line width and spacing, number of layers, maximum dimensions, and more.
We have the ability to handle blind burials in multi-layer boards.
SMT Process Capability
Advanced equipment in Mondo Technology’s factory, including Juki SMT devices from renowned Japanese brands. The table below show the equipment used in our SMT assembly.
High precision paste components, high accuracy, not easy to fall off.
| Solder paste printing | automatic loading and unloading machine, laser stencil thickness 0.08-0.15mm, Chip components 0201-1206, all kinds of LED lamp beads/Q/D/IC/BGA/CON and other components |
| Online SPI | online detection of solder paste printing quality, when there are undesirable phenomena such as offset/tin connection/less tin, it can immediately alarm to determine that it is defective, and the engineering technician will process and adjust it to avoid flowing into the next process; |
| Mounting | mounting component specifications 0201-74mm, circuit board size 600-370mm, accuracy ± 35um (CPK≧1), with precision camera; |
| Reflow soldering | JT double track 8 temperature zone &10 temperature zone hot air reflow soldering; |
| Online AOI | can detect 2 different models of products at the same time, independently store data, convenient for access and tracking; |
| Placement machine model | Japan JUKI3010/RS-1/RS-1R series; |
| Automatic printing machine | Desen DS-1008, Zhengshi ZS-A5 series; |
| Double-track reflow soldering | Jintuo; |
| Dual-track online AOI | Hurley; |
| SPI | Steike; |